Intel Corporation Senior ASIC/Layout Design Engineer Interview Questions

Updated 11 May 2018

To filter interviews, or .
Found 2 of over 4.7K interviews

Interviews at Intel Corporation

Experience
Positive100%
Getting an Interview
Employee Referral100%
Difficulty
3.5
Average
HardAverageEasy

Intel Corporation

Anonymous Employee in Jerusalem

Accepted Offer
Positive Experience
Difficult Interview
Application

I applied through an employee referral The process took 3 weeks. I interviewed at Intel Corporation (Jerusalem) in Jun 2014

Interview

three interviews, first by senior team engineer, professional questions, what did you do in the past, what is UPF, how to do CTS, what is CRPR, what is AOCVM, what is patterning in 10nm process, how to design mesh, 3 power domain grid, how using UPF in DC, STA, how to run MCMM, how to use DMSA . Second by 2 managers, third by Human resource representative.

Interview Questions
  • What did you do in the past, how to implement low power design, how to build CTS, how to do STA
    Answer Question
Be the first to find this interview helpful

Intel Corporation

Anonymous Employee in Bangalore

Accepted Offer
Positive Experience
Average Interview
Application

I applied through an employee referral The process took 1 day. I interviewed at Intel Corporation (Bangalore) in Jan 2014

Interview

there were three rounds of interview, two rounds of technical and one round of HR interview. technical rounds were to evaluate the experience and skills. HR round mainly personality and reason for change

Interview Questions
Be the first to find this interview helpful
RSS Feed</>Embed

Popular Careers with Intel Corporation Job Seekers

JobsSalariesInterviews

Work at Intel Corporation? Share Your Experiences

Intel Corporation logo
or