Conduct die attach process development for new products, which includes optimizing parameters and validating processes.

Your Role

Key responsibilities in your new role

• Develop innovative processes and methodologies for process characterization for both existing and new technologies.
• Collaborate with manufacturing and equipment teams to ensure effective integration of processes.
• Support the assembly of prototype and development samples.
• Carry out risk assessments and identify technical challenges.
• Assist with the qualification and setup of equipment for new bonding technologies, such as Die Attach, Clip Bond, and Reflow Oven.
• Provide input for updating relevant documents and ensure their accuracy, including Process Specification, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, FMEA, OJTI/WI, T32, etc., for development projects.

Your Profile

Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering or relevant course with 1 year working experience in semiconductor manufacturing industry or others relevant industry.
• Fresh graduate welcome to apply.
• Strong hands-on knowledge and skills in FOL process/ Die Attach/Clip Bonder process is an advantage.
• Proficient in JMP, Minitab, or equivalent tools for DOE and statistical analysis.
• Team player with good communication, presentation skills and interpersonal skills.

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