I received an offer after completing the interview process. At no point during interviews or in the offer letter was a bond mentioned. The bond was introduced only during joining formalities, which felt non-transparent. Such terms should be disclosed upfront.

Quick, and short. The difficulty level was moderate, video call via teams. 3 rounds, technical, team lead round, hr round. Questions were good and up to the mark. Everything went on time. It happend a long back, but sharing it now. I was in touch with prafful and then akansha. Pallavi took the final round.