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      Transfix

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      Software Engineer(Internship) Interview

      1 Apr 2017
      Anonymous interview candidate
      New York, NY
      No offer
      Positive experience
      Average interview

      Application

      I applied through university. The process took 2 weeks. I interviewed at Transfix (New York, NY) in Jan 2017

      Interview

      Very well structured interview process. Started with usual HR round, followed by phone interview with code pad with one of the engineers to test coding ability. Then I was called for on-site which had 4 technical round and one HR. Tech rounds mostly focused on Algorithms and Design oriented questions. Overall experience was really nice. Only negative thing is that persons who were interviewing were bit unprepared.

      Interview questions [1]

      Question 1

      Straight from Leetcode. (medium).
      Answer question

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