Having 3 rounds of interview. Questions based on system verilog,UVM and PCIe. SV and UVM questions were too easy for experienced people. Also He asked some scripting related questions. Also he asked verification flow based questions.
I applied through a recruiter. The process took 2 days. I interviewed at Wafer Space (Bengaluru) in Mar 2016
Interview
1. Initial level of telephonic discussion with HR. After this discussion HR scheduled a telephonic discussion round. Telephonic technical round by a Manager. The imphasis was on technical in-depth understanding, out of box thinking, creative ideas etc. It was followed by a Face to face Technical Round. Finally Face to face technical round at client location.
Interview questions [1]
Question 1
1. How did my out of box thinking helped to develop a more scalable product/feature.
