To define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization.

Your Role

Key responsibilities in your new role

• Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact.
• Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed..
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication(A3).
• Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
• Support pre development & project definition stage, and continue tobe package design expert throughout project phase.

Your Profile

Qualifications and skills to help you succeed

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 7 years of relevant working experience in IC/semiconductor environment/SMT.
• Knowledge in SMT, Semiconductor Packaging, Assembly and Test.
• Process and Equipment Engineering knowledge.
• Knowledge in Failure Analysis and Reliability Engineering.
• Knowledge in Analytical and Problem Solving Skills.
• AutoCAD and 3D drafting knowledge preferred.

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